Ambitec Gam 70 Laser Vision Measurement

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  • Ambitec Gam 70 Laser Vision Measurement

Ambitec Gam 70 Laser Vision Measurement

Ambitec SMT Process Equipment

It helps in surveying and inspecting the quality of tin solder on printed circuit boards. It measures the length and thickness of each path and also records the gap between adjacent solders. The recorded data for each PCB is stored automatically in system file and if needed, can be printed as a report.The solder thickness distribution diagrams and control diagrams of X_BAR_R are efficiently recorded by the machine for each product in different production lines.

Salient Features include User friendly interface for ease of operation. Laser contact less technology to prevent damage due to contact; Operational modes: Manual & Automatic.Automatic focus adjustments based on PC board thickness.; Full screen display for easy sampling, operation.Real time display of all survey parameters for better quality control and elimination of printing defects such as bridging, location deviation etc.

  • All operation are easy and using Window's interface in Chinese/English version.
  • Survey the thickness of tin solder by automatically or manually.
  • Survey the length and width manually, and the gap of tin solder.
  • Calculate the measure of area, the measure of cross-section and the measure of volumn automatically.
  • All surveyed values can be recorded to a file and be printed to a report.
  • Provide the diagrams of thickness distribution and control diagrams of X_BAR_R.
  • Calculate manfacture ability degree automatically (Cp,Cpk,Cpm).
  • It can have separate record according to every different production line.
  • It can adjust focal distance in different thickness of PC boards.
  • It can be called  to sample periodically.


  • Surveying the thickness of printing tin solder, length, height and gap.
  • Provide the references of thickness distribution values.
  • Provide the analysis of different measure of cross-section.
  • Calculate the measure of area and volumn automatically in object which to be surveyed.
  • Provide all diagrams of statistics and analysis.
    Provide X Control Diagram, R Control Diagram and Thickness List Diagram.
    Provide X Average Control Diagram, Single Point List Diagram.

【Application 】

  • Get the results of statistics and analysis about all surveyed values in every thickness degree.
  • Inspect the quality of solder printing process.
  • Survey the thickness of tin solder.
  • Measure the dimension of tin solder.
  • Provide thickness and dimension measurement function for other objects.

【Printing For Control Chart】

  • -R control chart.
  • Cp, Cpk, Cpm capability index.

【Operation And Measurement】


    • Display image full of screen.
    • Easy to sample.
    • Easy to operate
    • Real-time appearing the statistic.

    【Distributive Thickness Chart】

    • Display and print the distributive thickneess chart.
    • Disply and print all the statistic.
    • Analysis the percentage for distributive thickness.







    Visual Range (mm)

    2.5×2 mm







    Measurement Table W×L(mm)

    350×265 mm



    Repeat Accuracy (mm)





    0.007 mm



    Inspection Method

    Laser Vision



    Computer Specification

    IBM Compatible Interface




    15" LCD




    Color CCD Camera




    LED Ring Light




    Focusing Control System








    Chinese/English version




    110V.60Hz / 220V.50Hz



    Dimensions L×W×H(mm)

    350×400×350 mm




    30 kg







    Above View



    Front View

    Lateral View