Electrolube TBS Thermal Management System

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  • Electrolube TBS Thermal Management System

Electrolube TBS Thermal Management System

Electrolube Thermal Management System

The Thermal Bonding Compound (TBS) consist of two metal oxide based epoxy solvents, which on mixing and application showcase excellent bonding and thermal conductivity characteristics while staying electrically insulating.It is specifically designed for applications requiring special thermal conductivity qualities for instance in manufacture of heat sink assemblies. The solution has high bond strength and excellent adhesion, therefore serves as an alternative to welding and brazing processes.

The easy to prepare mixture cures efficiently at room temperature and consists of minute solid glass spheres to ensure uniform thickness throughout application area.

Salient Features Include: Two part epoxy bonding; Easy preparation; Excellent bond strength; Excellent adhesion; High thermal conductivity: 1.10 W/m.K; Wide operating temperature range: -40°C to +120°C; Uniform thickness throughout application; Bonding medium in surface mounting assemblies; RoHS Compliant.


Thermal Bonding System

20ml syringe - 1Kg


  • Two part epoxy bonding system with thermal 
  • conductivity of 1.1 W/m.K
  • Eliminates need for mechanical fixing by providing a permanent bond
  • Cures at room temperature