Chemtronics BGA Wick Repair Consumables

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  • Chemtronics BGA Wick Repair Consumables

Chemtronics BGA Wick Repair Consumables

Chemtronics Soldering Consumables

The wick is fabricated from high density copper strands which are precisely cross braided to eliminate oxygen penetration in the pores and therefore ensure fast and safe desoldering. The copper ensures optimum heat transfer via braid to the excess solder to quickly melt and suck it without damaging the circuit board.


It desolders 40% faster than the conventional wick because of its high suction capabilities and eliminates residual flux on pcb.


Specifically used in Ball Grid Array (BGA) type of pcb layout and prevents damaged to pads and traces when used properly.


Salient Features include Elimination of residual solder cleaning;Elimination of ionic contamination on the boards; Packaged in Vacuum – Packs and ESD-safe static dissipative bobbins; Minimizes heat damage to the board;RoHS compliance

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Features
  • Sized and Designed specifically for BGA Pads
  • Packed in convenient Vacuum – Packs
Specifications
Product Size Colour 5’
1.5m
10’
3.0m
25’
7.5m
100’
30.5m
500’
30.5m
VacupakTM Application
Soder-WickR
BGA Rosin
BGA Purple 80-BGA-5         SW180BGA BGA Pads and Chips
Soder-WickR
BGA No Clean
BGA Purple 60-BGA-5         SW160BGA BGA Pads and Chips