Electrolube HTCP Thermal Management System
Electrolube HTCP Thermal Management System
The Non-silicone Heat Transfer Compound Plus (HTSP) is a non-curing heat transfer paste, which provides excellent thermal conductivity for wide temperature range of -50°C to +130°C, while staying electrically insulating. The compound is based on non-silicone oil and therefore avoids issues with silicone and low molecular weight (LMW) siloxane migration.
HTCP – Non-silicone Heat Transfer Compound Plus
20ml – 1Kg – 25Kg – 700g
This thermal interface material is developed from metal oxides/ceramic powders and designed for applications requiring large amount of heat to be dissipated efficiently, ensuring reliable thermal coupling.
Salient Features
- Non silicone oil base
- Superior thermal conductivity: 2.5W/m.K
- Wide operating temperature range from -50°C to +130°C
- Very low viscosity for ease of application
- Easy to handle, economic in use and low in toxicity
- Excellent non-creep characteristics
- White colour enables treated parts to be easily identified
- Non-curing paste
- Allows simple and efficient rework of components if required
- RoHS-2 Compliant.
- Low evaporation weight loss
Why Choose Sumitron ?
