Electrolube HTCP Thermal Management System

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  • Electrolube HTCP Thermal Management System

Electrolube HTCP Thermal Management System

Electrolube Thermal Management System

The Non-silicone Heat Transfer Compound Plus (HTSP) is a non-curing heat transfer paste, which provides excellent thermal conductivity for wide temperature range of -50°C to +130°C, while staying electrically insulating. The compound is based on non-silicone oil and therefore avoids issues with silicone and low molecular weight (LMW) siloxane migration.This thermal interface material is developed from metal oxides/ceramic powders and designed for applications requiring large amount of heat to be dissipated efficiently, ensuring reliable thermal coupling.


Salient Features Include: Non silicone oil base; Superior thermal conductivity: 2.5W/m.K; Operating temperature range from -50°C to +130°C; Very low viscosity for ease of application; Easy to handle, economic in use and low in toxicity; Excellent non creep characteristics; White colour enables treated parts to be easily identified; Non-curing paste; allows simple and efficient rework of components if required; RoHS-2 Compliant.

OR

HTCP
Non-silicone Heat Transfer Compound Plus

 

20ml - 1Kg - 25Kg - 700g

 

 

  • Excellent non-creep characteristics.
  • Excellent thermal conductivity, 2.5W/m.K.
  • Wide operating temperature range: -50°C to +130°C
  • Low evaporation weight loss
  • White colour enables treated parts to be easily identified