Electrolube HTSP Thermal Management System

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  • Electrolube HTSP Thermal Management System

Electrolube HTSP Thermal Management System

Electrolube Thermal Management System

The Silicone Heat Transfer Compound Plus (HTSP) is a silicon oil based, non-curing heat transfer paste, which provides ultimate thermal conductivity for wide temperature range of -50°C to +200°C, while staying electrically insulating.


This thermal interface material is developed from metal oxides/ceramic powders and designed for applications requiring large amount of heat to be dissipated efficiently, ensuring reliable thermal coupling.


Salient Features Include: Superior thermal conductivity: 3.0W/m.K; Operating temperature range from -50°C to +200°C; Very low viscosity for ease of application; Easy to handle, economic in use and low in toxicity; Excellent non creep characteristics; White colour enables treated parts to be easily identified; Non-curing paste; allows simple and efficient rework of components if required; RoHS-2 Compliant.

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HTSP

Silicone Heat Transfer Compound Plus

50ml tube - 35ml syringe - 1Kg - 10Kg - 25Kg

 

  • Superior thermal conductivity even at high temperatures, 3.0 W/m.K
  • Excellent non-creep characteristics
  • Wide operating temperature range -50°C to +200°C
  • Low evaporation weight loss