Electrolube TBS Thermal Management System
Electrolube TBS Thermal Management System
The Thermal Bonding Compound (TBS) consist of two metal oxide based epoxy solvents, which on mixing and application showcase excellent bonding and thermal conductivity characteristics while staying electrically insulating. It is specifically designed for applications requiring special thermal conductivity qualities for instance in manufacture of heat sink assemblies. The solution has high bond strength and excellent adhesion, therefore serves as an alternative to welding and brazing processes.
TBS – Thermal Bonding System
20ml syringe – 1Kg
The easy to prepare mixture cures efficiently at room temperature and consists of minute solid glass spheres to ensure uniform thickness throughout application area.
Salient Features
- Two part epoxy bonding system with thermal .
- Easy preparation.
- Excellent bond strength.
- Excellent adhesion.
- High thermal conductivity: 1.10 W/m.K
- Wide operating temperature range: -40°C to +120°C.
- Uniform thickness throughout application.
- Bonding medium in surface mounting assemblies.
- RoHS Compliant.
- Eliminates need for mechanical fixing by providing a permanent bond.
- Cures at room temperature.
Why Choose Sumitron ?
