Kester Solder Paste

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  • Kester Solder Paste

Kester Solder Paste

Kester Solder Equipments

Solder paste which is No-Clean, Water Soluble, Halogen-Free and Lead-Free.It is best suited for solder paste printing. . It can work with a wide range of printing options such as, different printer speeds, long idling timings, and so on. It can be used in wide range of temperature and humidity settings.It has excellent soldering and wetting properties in air or nitrogen reflow. Minimum defects after soldering. Less voids. It works well with most conformal coating materials.

It is RoHS compliant. Solder paste passes SIR testing when tested in damp cycling conditions.

 It is an excellent choice for printing and reflowing of the 01005 components.




Kester EM907 is a lead-free, air and nitrogen reflowable, no-clean solder paste specifically designed for the thermal requirements of lead-free alloys, including the SAC305 alloy. The paste flux system allows joint appearances that closely resemble that achieved with SnPb alloys. EM907 is capable of stencil printing downtimes up to 60 minutes with an effective first print down to 20 mils without any kneading. EM907 also exhibits excellent continual printability for fine pitch (0.4mm/16 mils) and is able to print at high speeds up to 6 in/s (150 mm/s). This solder paste also exceeds the reliability standards required by J-STD-004.







EP256HA is a no-clean, air or nitrogen reflowable solder paste specifically designed to provide maximum print characteristics and solderability on lead-free parts using leaded solder paste. EP256HA has been designed for applications that require the ultimate activity with respect to difficult to solder to components and board surface metalizations. EP256HA is also capable of stencil printing after downtimes of up to 90 minutes with an effective first print down to 20 mils. EP256HA is a solder paste formula that maintains its activity and printing characteristics for up to 8 hours without any shear thinning.








Kester NP505-HR is a zero-halogen, lead-free, no-clean solder paste formula developed specifically for high reliability applications. NP505-HR has been formulated to have reliable residues even in harsh damp cycling SIR testing. NP505-HR can handle a wide variety of printer variables, including print speed and long idle times with a wide range of temperatures and humidities. NP505-HR is fully capable of printing and reflowing 01005 components in air reflow with minimal graping behavior. Post-soldering, the NP505-HR offers minimized defects, including head-in-pillow and QFN/BGA voiding. This paste is zero-halogen, exceeding the IPC definition for halogen-free. NP505-HR is classified as ROL0 per IPC J-STD-004B.