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» GAM 30 V-Cut PCB Separator
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Specification
01. X.Y cutting speed. 0~100mm/s
02. Repeat precision of the Machine set.± 0.01mm
03. X.Y.Z driving method.AC servomotor
04. X.Y.Z control method.Use the industrial IPC and PC
05. Human-machine operation and data storage.PC system
06. Cut the precision.± 0.1mm
07. Rotational speed of the main shaft.MAX40000rpm
08. Host voltage.220V 1ψ 50 / 60HZ
09. Air pressure supply.4.5kg/cm2 above
10. Power consumption.3KVA
11. Dust collection method.Lower dust collection
12. Voltage of the dust collector.220V (380V) 3ψ
13. Lower dust collection size.665*635*1610mm
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>>Suitable for light piece connect with stiff to cut more, for instance mobile telephone machine board, several camera, PDA,etc
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>>Utilize one pair of slides to pass in and out and put the work piece, reduce and fetch and put the board
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Pair manages having type every type difference to prove
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Type
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Specifications
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Operation
distance
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Host size
D*W*H (unit:mm)
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Weight of the host
+the dust collector
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Single
Chuck
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SS
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Small,Upper dust collector
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400x400mm
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1200*1150*1450
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650 KG
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SL
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Large,Upper dust collector
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500x450mm
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1200*1150*1450
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650 KG
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SD
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Small,Lower dust collector
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400x450mm
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1200*1150*1450
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790 KG
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SW
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Large,Lower dust collector
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500x450mm
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1200*1150*1450
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790 KG
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Double
Chuck
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DS
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Standard
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285x340mm
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1470*1150*1450
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800 KG
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DL
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Extension
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285x450mm
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1470*1150*1450
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800 KG
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DW
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Widen
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350x450mm
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1470*1300*1450
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840 KG
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DX
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Specially wide
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500x450mm
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1470*1600*1450
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880 KG
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AV
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Vision IN-LINE
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300x330mm
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1100*1350*1700
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840 KG
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. Apolegamy function . ..Vision automatic positionn.. Change Double chuck into Large-scale Single chuck
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GAM 30 V-Cut PCB Separator (The Best Achievements For Reduce Stress)
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- Firm structure be designed to prevent electronic circuit, solder point, and solder cutting area of PCB from damage by unsuitable force.
- Effectivly reduce stress and prevent solder chap from PCB separation.
- Unique material of blade, ensure the smooth cutting edge of PCB.
- Touchable panel with five route adjustment be considered to fast change different size of PCB.
- Equipped wiht a high frequency lighting to protect eyes and enhance efficiency for operating.
- Strengthen safety device, prevent harm from operator.
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Application
- PCB separating after SMT process.
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Contrast of Separation Edge
Smooth Cutting Edge(by GAM 30) |
Coarse Cutting Edge(by hand)
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By GAM 30
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By Hand
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Option
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Cutting Capability
- Maximum Cutting Dimensions(mm) 400×150
- Maximum Cutting Thickness(mm) 3.2
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- A. PC Board Cut Thickness(mm) 1.0~3.2
- B. Minimum V-CUT Size(mm) 0.25
- C. PC Board V-CUT Fillister Thickness(mm) 0.3~0.8
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Specification
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Blade Velocity(mm/sec)
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150,250,350,500 mm/sec
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Blade Route(mm/max)
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400(change with the length chosen) mm/max
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Blade Material
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Alloy Steel
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Blade Trimming(mm)
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0~2 mm
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Down Material Board Trimming(mm)
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0~50 mm
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Normal Rated Power(W)
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250 W
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Back Shield Board Depth Trimming (mm)
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0~150 mm
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Power Supply(V)
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110/220 V
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Blade Size(mm)
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Diameter 150 mm
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Down-Blade Size(mm)
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460 mm
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View
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Above View
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Front View
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Lateral View
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