Spark 400

General
The Spark 400 is a multi-process assembly platform designed for assembling low to medium volume PCB lots, automatic rework and prototype assembly. It concurrently performs paste dispensing, component placement and laser soldering (using 4 lasers that work simultaneously and independently), without impacting already assembled components.
 
The Spark 400 is suitable for a wide range of present and emerging packaging technologies, including fine pitch SMT, BGA, Flip-Chip and other components.  Among the many advantages of the Spark 400 are: automated selective assembly, replacement de-facto of a whole line of machines, thus saving capital investment, manpower, set-up time and footprint.
 
Spark 400 - New Machine Feature
BeamWorks has developed the “Dipping” Process for QFP. Using this process, there is no need to apply solder paste after removal of the component since the laser leaves behind almost all the original solder on the pads. The remaining solder is reflowed immediately after component removal. The Dipping process reduces removal and replacement time for QFPs from 10 to 3.5 minutes.” BeamWorks' dipping process won the SMT 2006 Vision Award in the Rework and Repair category.

 

• Closed loop temperature controlled soldering
• No stencil required
  Spark 400 fully automates rework by selectively dispensing solder paste, placing components and processing reflow without heating neighboring components. It selectively assembles many part types without the problem (and the cost) of changing nozzles and stencils for each type.
• Flexible operation allows for fast turn around
  Spark 400 makes production planning easier, e.g. the production plan does not have to be reshuffled for the SMT line if some components do not make it on time because assembly can proceed with one or more missing components.
• Precise heating without impacting adjacent components
• Auto load of CAD and BOM data
• Small footprint
• Thin intermetallic layer for improved reliability
• No baking of moisture sensitive components
• If a certain lead of a given component is connected to power or ground plane, the laser soldering time is longer for that lead than for the adjacent lead not connected to a heat sink.
   

System Features

• Vision system for auto alignment using board fiducials
• Using standard CAD and BOM files and utilizing on-board component library of components geometry
• Win 2000 operation system and comfortable GUI
• Simultaneous operation of 4 lasers provides high soldering throughput
• Full SMEMA support allows in-line operation
• Either stand alone or in-line operation